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VeTek semiconductor Technology Co., LTD

Products >> Silicon Carbide Seed Crystal Bonding Vacuum Hot-Pr

Silicon Carbide Seed Crystal Bonding Vacuum Hot-Pr

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Description
Product Name: Silicon Carbide Seed Crystal Bonding Vacuum Hot-Pr
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The SiC seed bonding technology is one of the key processes that affect crystal growth.VETEK has developed a specialized vacuum hot-press furnace for seed bonding based on the characteristics of this process. The furnace can effectively reduce various defects generated during the seed bonding process, thereby improving the yield and the final quality of the crystal ingot.



Introduce

1.The furnace is used for seed bonding before SiC crystal growth

2.The bonded seed can remain firmly attached at a temperature of 2300℃, maintaining 100% adhesion without air bubbles, with high flatness, clean surface of the seed, and no impurities adsorbed

3.The heated plateform is adopted resistanceheating of spiral disc-shaped, uniform heating zone, it¡¯s savety to use, easy to operate

4.The bottom of the load plateform equipped with force sensors, the downforce on the workpiece to be precise displayed



Function Introduction



1.The water-cooled metal chamber of the double-wall reduces the outer surface temperature of the furnace body effectively, minimizes high-temperature harm and lowers the i***ct on the environment.

2.It can achieve automatic increase downforce and force holding, slow loading force , and displacement can be automatically controlled.

3.Diversified vacuum configurations are available, and different vacuum levels can be selected according to the process.

4.Uniform pressure and high temperature control accuracy.

5.The downforce structure adopts a precise mechanical thrust disign, ensuring accurate and stabledownforce, safe use and environmental friendliness.

6.The down stamp is connected to the push rod with "universal" way. It is ensure when the workpiece is suppressed, the surface of down stamp is under adaptive parallel with the surface of the heated plateform , ensure the workpiece bearing the uniform downforce.

7.The down stamp has a function of buffering loading downforce, providing smooth and soft downforce without i***ct, thus to prevent cracking of the workpie

Contact Us
Company: VeTek semiconductor Technology Co., LTD
Contact: Ms. Andy Year
Address: Wangda Road, Ziyang Street, Wuyi County, Jinhua City, Zhejiang Province, China
Postcode:
Tel: 15300650061
Fax:
E-mail:          


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